Senior Packaging Engineer (733929)
| Dyddiad hysbysebu: | 11 Gorffennaf 2025 |
|---|---|
| Cyflog: | £46,735 i £57,422 bob blwyddyn |
| Oriau: | Llawn Amser |
| Dyddiad cau: | 01 Awst 2025 |
| Lleoliad: | Renfrew, Renfrewshire |
| Gweithio o bell: | Ar y safle yn unig |
| Cwmni: | University of Strathclyde |
| Math o swydd: | Parhaol |
| Cyfeirnod swydd: | 733929 |
Crynodeb
Salary range: £46,735 - £57,422 per annum
FTE: 1
Term: Open ended
Closing Date: 01 August 2025
Location: Renfrew
The University has been successful in attracting capital support for the establishment of the National Advanced Semiconductor Packaging and Integration Centre (NASPIC), based within our new facility close to Glasgow Airport. The line is one of a kind as it has been designed to allow for a broad range of present and future devices. Its open access governance model is unique in Europe and very rare elsewhere. NASPIC will explore and develop disruptive packaging and integration technologies to make next-generation systems at lower cost and with more energy and packaging efficiency.
NMIS is seeking to appoint an experienced and innovative Senior Packaging Engineer to lead the development of advanced packaging technologies, contributing to next-generation semiconductor products. The Senior Packaging Engineer will lead a multidisciplinary team of engineers and researchers, with responsibility for the strategic and technical development of packaging capability scale-up for power electronics, photonics and advanced CMOS systems. You will shape the long-term direction of process manufacturing and assembly capabilities to scale-up back-end processes, contributing to institutional strategies and influencing policy decisions related to advanced semiconductor packaging innovation.
For informal enquiries, please contact Gladys Benghalia, Head of Programmes - Electrification Manufacturing, gladys.benghalia@strath.ac.uk
FTE: 1
Term: Open ended
Closing Date: 01 August 2025
Location: Renfrew
The University has been successful in attracting capital support for the establishment of the National Advanced Semiconductor Packaging and Integration Centre (NASPIC), based within our new facility close to Glasgow Airport. The line is one of a kind as it has been designed to allow for a broad range of present and future devices. Its open access governance model is unique in Europe and very rare elsewhere. NASPIC will explore and develop disruptive packaging and integration technologies to make next-generation systems at lower cost and with more energy and packaging efficiency.
NMIS is seeking to appoint an experienced and innovative Senior Packaging Engineer to lead the development of advanced packaging technologies, contributing to next-generation semiconductor products. The Senior Packaging Engineer will lead a multidisciplinary team of engineers and researchers, with responsibility for the strategic and technical development of packaging capability scale-up for power electronics, photonics and advanced CMOS systems. You will shape the long-term direction of process manufacturing and assembly capabilities to scale-up back-end processes, contributing to institutional strategies and influencing policy decisions related to advanced semiconductor packaging innovation.
For informal enquiries, please contact Gladys Benghalia, Head of Programmes - Electrification Manufacturing, gladys.benghalia@strath.ac.uk
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